Snapdragon 898 prognosis: “Heated” Qualcomm chip in the first benchmarks

It’s no secret that Qualcomm is working on a successor to the Snapdragon 888+. In December, the chip manufacturer could announce its new SoC as Snapdragon 895/898. The possible increase in performance of the heated processor is now apparent from the first leaks.

Despite persistent heat problems, Qualcomm continues to increase the speed of its mobile processors, leaving the cooling to smartphone and tablet manufacturers, whose customers in the high-end sector seem to be demanding more and more performance. What happened when switching from the Snapdragon 888 to the Plus offshoot with a clock frequency of now three gigahertz, its successor should also be a real hothead. At least that’s what the Leaker Digital Chat Station (via Gizchina) assumes, which comments on the topic on Weibo.

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Further increase in performance despite heat problems?

Under the name Snapdragon 895 or Snapdragon 898, the US company could introduce another SoC flagship this year that will enable the information to provide a performance boost of around 20 percent. The extent to which the clock rates are increased further is just as little known as the benchmarks used for the tests. The production is to take place in the 4nm process optimized by Samsung. With regard to the heat development, the leaker speaks of luck “that the chip appears in winter”.

Digital Chat Station
Leaker, Digital Chat Station has already commented on the sm8450 SoC on Twitter. ! / © Digital chat station Twitter

If you trust your predictions, Qualcomm should continue to put performance first. However, since these tests are early copies of the new SM8450 chip, further optimizations could follow in order to avoid the high temperatures ex-works. In the worst case, if there is insufficient cooling in the upcoming flagship smartphone, users will have to accept a temporary throttling of the clock rate. Official confirmation of the new processor is still pending.

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