On the day after Christmas, Redmi presented the K60 series, which includes three models, two of which work with high-performance central processing units. The Redmi K60 Pro is equipped with Qualcomm’s current most powerful set, the Snapdragon 8 Gen 2, while the base model runs on the Snapdragon 8+ Gen 1. Both devices use an extensive internal cooling system to moderate the temperature and maintain maximum performance.
The 5000 mm2The efficiency of the integrated cooling system is increased by the new case, which not only protects the device but also actively contributes to cooling. In principle, the manufacturer uses the same dissipation technology as that used in the devices. The basically solid material inside the case becomes liquid due to heat transfer, which helps better distribution and more efficient heat release. According to Redmi’s calculations, the special protective case is 4 It lowers the temperature of the device by °C.