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A large plate has been placed on the back of the Oppo Find X6 Pro

A large plate has been placed on the back of the Oppo Find X6 Pro

Render images have already shown the design of this year’s flagship device from Oppo, the Find X6 Pro. Later, a couple of low-quality photos were taken of the yet-to-be-presented phone, on which it was seen that the back-panel cameras are located in a huge protrusion, but neither the back-panel itself nor the layout of the cameras could be clearly seen. This will change now, a clearly visible photo has been taken of the camera trio of the expected phone with Snapdragon 8 Gen 2 and MediaTek Dimensity 9200. This one was leaked via Weibo and it clearly and prominently shows Hasselblad and the “Powered by MariSilicon”, the latter refers to the ISP developed by Oppo, which debuted in last year’s model. The MariSilicon X2 is rumored to debut this spring, an improved version of last year’s chip, but there’s no evidence of that yet.

This is what the back of the Oppo Find X6 Pro might look like. (source: Weibo) [+]

It is interesting that, in addition to different SoCs, different camera sensors can be included in the phones, so the appearance of two types of Pro models can be expected in addition to the basic Find X6. The Find X6 Pro powered by the Dimensity chip can use a 50-megapixel Sony IMX890 CMOS sensor behind all three cameras (wide, ultra-wide, telephoto), on the other hand, the Snapdragon 8 Gen 2 model can get a Sony IMX989 for the main camera and an IMX890 for the ultra-wide, and into the telephoto. More information about the hardware can be found in this article.

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